Intrinsiq Materials has developed a range of nanocopper containing inks and pastes which are compatible with a wide variety of substrates and sintering techniques. This allows Intrinsiq Materials to provide products suited to a diverse group of applications. Our core nanocopper based inkjet ink and screen pastes are detailed in the table below, alongside this, we continue to work with our clients to ensure optimal performance is reached for their specific applications through the development of tailored solutions.
Printed copper conductors CP-007 on PET
Commercial Product Table
|Product||Type||Application||Description||Sintering Method||Download Datasheet|
|CF-001||Coating Fluid||Coating fluid for thin copper film||Nanocopper seed layer for electroplating on polyimide||Broadband flash (photonic sintering)||CF-001_Data_Sheet_2017_v1.2|
|CI-004||Nanocopper ink||Flex circuits||Inkjet ink for polyimide substrates||Convection oven with reducing atmosphere||CI-004_Data_Sheet_2017_v1.3|
|CI-005||Nanocopper ink||OLED, Display||Inkjet ink for ITO & Glass substrates||Laser, broadband flash or convection oven with reducing atmosphere||CI-005_Data_Sheet_2017_v1.3|
|CP-005||Copper Paste||Thin Film PV, CIGS, CIS, other||Screen print paste for PV metallisation||Laser||CP-005_Data_Sheet_2018_v1.1|
|CP-006||Copper Paste||PCB via fill||Paste||Convection oven with reducing atmosphere||CP-006_Data_Sheet_2018_v1.3|
|CP-007||Copper Paste||General purpose high performance screen print||Screen print paste for PET FR4, ceramic, fabric, coated glass||Convection oven with reducing atmosphere||CP-007_Data_Sheet_2018_v1.3|
|CP-008||Copper Paste||High copper low temperature paste||Screen print paste for low temperature substrate PEN, PET, polyimide, coated glass||Convection oven with reducing atmosphere||CP-008_Data_Sheet_2017_v1.2|
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