Visit our booth (ESMA Pavillion, Hall 6) at DRUPA 2016, Dussledorf, May 31-June 10.
Posts By: Intrinsiq
Please attend our presentation and visit our booth (26) at AFIP 2016, Dusseldorf, March 2-3
Intrinsiq is pleased to share the results of collaborative efforts in the field of inkjet printed copper interconnects. Electronic Engineering Times Article Sept 2013
Intrinsiq is pleased to present the results of collaborative efforts in the field of interconnects _IBM_IML_ECTC_paper
Intrinsiq is pleased to share the following publications regarding our ultra-thin copper technology: http://flex.iconnect007.com/index.php/article/91425/coated-ultra-thin-copper-on-printed-circuit-laminates/91428/?skin=flex and here: http://pcb.iconnect007.com/index.php/article/91425/coated-ultra-thin-copper-on-printed-circuit-laminates/91428/?skin=pcb
Come to our booth (E12) at Printed Electronics Europe 2016, Berlin, April 27-28.
Visit our booth (B0 204) at LOPEC 2016, Munich, April 6-7
Intrinsiq Materials Inc., was awarded a $450,000 by the U.S. Department of Energy SunShot Initiative to develop and commercialize an innovative method of using nickel silicide and copper in solar power cells. Intrinsiq Materials Sunshot Intitiative Press Release Electronics Industry
High performance LED’s lighting systems produce significant heat which require large heat sinks – these require careful design, complicated manufacturing processes and increase cost. One approach is to produce a different substrate; aluminum coated with a high performance ceramic with excellent electrical insulating properties yet with high thermal conductivity, giving a combined substrate/heat sink… Read more »
Situation The development of antibody based disease detection systems, using RF impedance measurements, by ELISHA, a spin out from Leeds University, has been underway for some years, with significant potential to quantitatively identify a wide range of diseases, such as STD’s, bladder and bowel cancer etc. However significant difficulties were found with existing electrode structures… Read more »