News

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High Resolution Inkjet Printing for Interconnects

Intrinsiq is pleased to share the results of collaborative efforts in the field of inkjet printed copper interconnects.

Electronic Engineering Times Article Sept 2013

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Nanocopper Assembly and Sintering Towards all Copper Flip Chip Interconnects

Intrinsiq is pleased to present the results of collaborative efforts in the field of interconnects

_IBM_IML_ECTC_paper

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Rochester-based Intrinsiq Materials Awarded $450,000 by U.S. Department of Energy

 

Intrinsiq Materials Inc., was awarded a $450,000 by the U.S. Department of Energy SunShot Initiative to develop and commercialize an innovative method of using nickel silicide and copper in solar power cells.

Intrinsiq Materials Sunshot Intitiative Press Release Electronics Industry

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Intrinsiq Materials Launches LAPS-60 Precision Sintering Systems

Intrinsiq Materials is pleased to introduce and demonstrate our LAPS 60 Precision Sintering System. Capable of rapidly sintering Printed Copper tracks, the LAPS-60 enables Intrinsiq’s customers to create low cost, highly conductive tracks on a variety of media from glass, to paper, and plastic without damaging the substrate.

Intrinsiq LAPS laser precision sintering systems launched May2014vf2

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Intrinsiq Materials awarded $887K by NYSERDA to develop copper ink for Solar Cell Applications

NYSERA AWARD