Visit our booth (ESMA Pavillion, Hall 6) at DRUPA 2016, Dussledorf, May 31-June 10.
Monthly Archives: December 2015
Please attend our presentation and visit our booth (26) at AFIP 2016, Dusseldorf, March 2-3
Intrinsiq is pleased to share the results of collaborative efforts in the field of inkjet printed copper interconnects. Electronic Engineering Times Article Sept 2013
Intrinsiq is pleased to present the results of collaborative efforts in the field of interconnects _IBM_IML_ECTC_paper
Intrinsiq is pleased to share the following publications regarding our ultra-thin copper technology: http://flex.iconnect007.com/index.php/article/91425/coated-ultra-thin-copper-on-printed-circuit-laminates/91428/?skin=flex and here: http://pcb.iconnect007.com/index.php/article/91425/coated-ultra-thin-copper-on-printed-circuit-laminates/91428/?skin=pcb